Global Platelet Level Packaging Market (2021-2026)

DUBLIN, November 26, 2021 / PRNewswire / – The “Platelet Level Packaging Market: Global Industry Trends, Share, Size, Growth, Opportunities, and Forecast 2021-2026” report has been added to ResearchAndMarkets.com offer.

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The global wafer-level packaging market has experienced strong growth during the period 2015-2020. Going forward, the publisher expects the market to grow at a CAGR of around 11% during 2021-2026.

Wafer Level Packaging (WLP) refers to a packaging solution used to add a protective layer of electronic connections and integrated circuits (ICs). It is used for devices such as microphones, pressure sensors, accelerometers, gyroscopes, capacitors, resistors and transistors. Some of the commonly used WLP integration types include fan-out (FO), fan-in (FI), flip-chip, 3D FOWLP. These solutions are used at the wafer level of the device, instead of cutting the wafer into the individual chip and wrapping them. This provides various benefits, such as a reduction in the size of the wafer chips, streamlining of manufacturing processes, and improvements in chip functionality. Ultra-thin pads also offer improved heat dissipation and performance, reduced form factor, and minimal power consumption.

The significant growth of the electronics industry across the globe represents one of the key factors creating a positive outlook for the growth of the market. In addition, the growing demand for more compact and faster consumer electronics is also driving the growth of the market. It has also increased the overall demand for cost-effective, high-performance packaging solutions for improved mechanical protection, structural support, and extended device battery life. In addition, various technological advancements, such as the integration of devices connected to the Internet of Things (IoT), act as other growth drivers.

For example, WLP is widely used for manufacturing radar systems in autonomous automobiles. It is also used in the healthcare sector for the production of various wearable devices. Other factors, including increasing circuit miniaturization in microelectronic devices, along with extensive research and development (R&D) activities, are expected to further drive the market.

Competitive landscape:

The competitive landscape of the industry was also examined along with the profiles of the major players being Amkor Technology Inc., China Wafer Level CSP Co. Ltd., Chipbond Technology Corporation, Deca Technologies Inc. (Infineon Technologies AG), Fujitsu Limited, IQE PLC, JCET Group Co. Ltd., Siliconware Precision Industries Co. Ltd. (Advanced Semiconductor Engineering Inc.), Tokyo Electron Ltd. and Toshiba Corporation.

Key questions addressed in this report:

  • How has the global platelet-level packaging market performed so far and how will it perform in the years to come?

  • What has been the impact of COVID-19 on the global platelet-level packaging market?

  • What are the main regional markets?

  • What is the distribution of the market according to the type of packaging?

  • What is the market split based on end use industry?

  • What are the different stages of the industry value chain?

  • What are the main factors and challenges for the industry?

  • What is the structure of the global blister pack packaging market and who are the major players?

  • How competitive is the industry?

Main topics covered:

1 Preface

2 Scope and methodology

3 Executive summary

4 Presentation
4.1 Overview
4.2 Key Industry Trends

5 Global packaging market at the platelet level
5.1 Market overview
5.2 Market performance
5.3 Impact of COVID-19
5.4 Market Forecast

6 Market breakdown by packaging technology
6.1 3D TSV WLP
6.1.1 Market trends
6.1.2 Market Forecast
6.2 2.5D TSV WLP
6.2.1 Market trends
6.2.2 Market Forecast
6.3 WLCSP
6.3.1 Market trends
6.3.2 Market Forecast
6.4 Nano WLP
6.4.1 Market trends
6.4.2 Market Forecast
6.5 Others
6.5.1 Market trends
6.5.2 Market Forecast

7 Market breakdown by end-use industry
7.1 Aerospace and defense
7.1.1 Market trends
7.1.2 Market Forecast
7.2 Consumer electronics
7.2.1 Market trends
7.2.2 Market Forecast
7.3 IT and telecommunications
7.3.1 Market trends
7.3.2 Market Forecast
7.4 Health care
7.4.1 Market trends
7.4.2 Market Forecast
7.5 Automotive
7.5.1 Market trends
7.5.2 Market Forecast
7.6 Others
7.6.1 Market trends
7.6.2 Market Forecast

8 Market breakdown by region

9 SWOT analysis

10 Value chain analysis

11 Analysis of the five forces of carriers

12 Price analysis

13 Competitive landscape
13.1 Market structure
13.2 Key players
13.3 Profiles of key players
13.3.1 Amkor Technology Inc.
13.3.1.1 Company presentation
13.3.1.2 Product portfolio
13.3.1.3 Finances
13.3.1.4 SWOT Analysis
13.3.2 China Wafer Level CSP Co. Ltd.
13.3.2.1 Company overview
13.3.2.2 Product portfolio
13.3.2.3 SWOT Analysis
13.3.3 Chipbond Technology Company
13.3.3.1 Company overview
13.3.3.2 Product portfolio
13.3.3.3 SWOT Analysis
13.3.4 Deca Technologies Inc. (Infineon Technologies AG)
13.3.4.1 Company overview
13.3.4.2 Product portfolio
13.3.5 Fujitsu Limited
13.3.5.1 Company overview
13.3.5.2 Product portfolio
13.3.5.3 Finances
13.3.5.4 SWOT Analysis
13.3.6 IQE PLC
13.3.6.1 Company overview
13.3.6.2 Product portfolio
13.3.6.3 SWOT Analysis
13.3.7 JCET Group Co. Ltd.
13.3.7.1 Company overview
13.3.7.2 Product portfolio
13.3.7.3 SWOT Analysis
13.3.8 Siliconware Precision Industries Co. Ltd. (Advanced Semiconductor Engineering Inc.)
13.3.8.1 Company overview
13.3.8.2 Product portfolio
13.3.8.3 Finances
13.3.9 Tokyo Electron Ltd.
13.3.9.1 Company overview
13.3.9.2 Product portfolio
13.3.9.3 Finances
13.3.9.4 SWOT Analysis
13.3.10 Toshiba Corporation
13.3.10.1 Company overview
13.3.10.2 Product portfolio
13.3.10.3 Finances
13.3.10.4 SWOT Analysis

For more information on this report, visit https://www.researchandmarkets.com/r/dv534h

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