WILMINGTON, Mass .– (COMMERCIAL THREAD) – Onto Innovation Inc. (NYSE: ONTO) (“Onto Innovation”, “Onto” or the “Company”) today announced a total backlog of $ 500 million, of which more than $ 100 million for its lithography and inspection products in support of the emerging heterogeneous packaging industry, which covers technology designed for next-generation 2.5D and 3D packaging and those using hybrid bonding as a method of connecting stacked chips.
Heterogeneous packaging is expected to be the fastest growing segment in the advanced packaging market, driving an 11% CAGR growth rate for advanced packaging substrates over the next four years and reaching estimated revenue to $ 13 billion in 2025, according to TechSearch International. The rise of heterogeneous packaging as a new industry standard will be broad and transform the industry, delivering the increased performance needed for data center processors, advanced computing processors and mobile processors, as well as the advanced specialty packages needed for next-generation RF and image sensors. used in mobile devices and demanded by the expansion of 5G technology.
“The key to this market is the ability to increase interconnection density while simultaneously achieving high yields. The company has received orders of nearly $ 100 million for its new JetStep® X500 lithography system for shipment in 2022 and 2023 to support 2.5D heterogeneous packaging on advanced substrate panels, ”said Elvino DaSilveira, vice president and commercial director of lithography. “Onto Innovation’s suite of lithography, inspection and software products provide an integrated solution that enables our customers to achieve the precision and repeatability needed to bring these technologies from R&D to high-volume production. ”
Onto Innovation has also received over $ 12 million in orders for its Dragonfly® G3 inspection system. This state-of-the-art inspection system provides the sub-micron metrological resolution needed for advanced packaging using new hybrid binding technology. Hybrid bonding is a key part of the next generation of heterogeneous packaging and enables true 3D matrix-to-matrix stacking. Among the early adopters of this packaging technology is a leading manufacturer of a high definition CIS device, which is directly linked to a logic chip produced by a leading foundry.
“We work in partnership with our customers to go beyond providing them with the most precise data feeds for process control. We now offer them analyzes through fabs via our Discover® software, which enables a higher throughput link between chips at different manufacturing sites, ”said Ju Jin, senior vice president and general manager of the inspection business. “This is another example of Onto Innovation’s leadership in delivering flexible, high performance products covering the entire manufacturing process at factories across the value chain. ”
About Onto Innovation Inc.
Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of advanced technologies which include: Patternless wafer quality; 3D metrology covering the characteristics of chips, from nanoscale transistors to large chip interconnects; macro-defect inspection of platelets and packaging; metallic interconnect composition; factory analysis; and lithography for advanced semiconductor conditioning.
Our wide range of offerings across the semiconductor value chain help our customers solve their toughest efficiency, performance, quality and reliability challenges. Onto Innovation strives to optimize the critical path of progress for our customers by making them smarter, faster and more efficient.
Based in Wilmington, MA, Onto Innovation supports its clients with a global sales and service organization.
Additional information is available at www.ontoinnovation.com.
This press release may contain forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995 (the “Act”) which include: statements relating to the backlog; On the commercial dynamics and future growth of Innovation; the benefit for customers of Onto Innovation’s products; Onto Innovation’s ability to provide products and services in line with the demands and expectations of our customers and to strengthen its position in the market; as well as other matters which are not purely historical data. Onto Innovation wishes to take advantage of the “safe harbor” provided by law and warns that actual results may differ materially from those projected due to various factors, including risks and uncertainties, many of which are beyond Onto Innovation’s control. . These factors include, but are not limited to, the duration, severity and potential impact on business of the COVID-19 pandemic; the Company’s ability to leverage its resources to improve its position in its main markets; its ability to successfully integrate acquired businesses and technologies; its ability to weather difficult economic environments; its ability to open up new market opportunities and target high-margin markets; the strength / weakness of the back-end and / or front-end semiconductor market segments; fluctuations in client capital spending and any potential impact resulting from the new coronavirus situation. Additional information and considerations regarding the risks to Onto Innovation can be found in Onto Innovation’s Form 10-K report for the year ended December 26, 2020 and other documents filed with the Securities and Exchange Commission. Since forward-looking statements are based on Onto Innovation’s current expectations, the Company cannot guarantee any related future results, level of activity, performance or achievement. Onto Innovation assumes no obligation to update any forward-looking information contained in this press release.
Source: Onto Innovation Inc.